The DRV8833 device provides a dual bridge motor driver solution for toys,printers.and other mechatronic applications.The device has two H-bridge drivers, and can drive two DC brush motors, a bipolar stepper motor,solenoids, or other inductive loads.The output driver block of each H-bridge consists of N-channel power MOSFETs configured as an H bridge to drive the motor windings. Each H-bridge includes circuitry to regulate or limit the winding current. Internal shutdown functions with a fault output pin are provided for overcurrent protection, short-circuit protection,Undervoltage lockout,and overtemperature. A low-power sleep mode is also provided The DRV8833 is packaged in a 16-pin WQFN package with PowerPAD TM (Eco-friendly: RoHS & noSb/Br).

Description PC817X Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V(*) and CTR is 50% to 600% at input current of 5mA.

The LM833 is a monolithic dual operational amplifier particularly well-suited to audio applications.

ULN2003A is a stepper motor driver IC. This article mainly introduces pinout, specifications, features, and other detailed information about STMicroelectronics ULN2003A.

The DCM Isolated, Regulated DC Converter is a DC-DC converter, operating from an unregulated, wide range input to generate an isolated 48.0 Vdc output. With its high frequency zero voltage switching (ZVS) topology, the DCM converter consistently delivers high efficiency across the input line range. Modular DCM converters and downstream DC-DC products support efficient power distribution, providing superior power system performance and connectivity from a variety of unregulated power sources to the point-of-load. Leveraging the thermal and density benefits of Vicor’s ChiP packaging technology, the DCM module offers flexible thermal management options with very low top and bottom side thermal impedances. Thermally-adept ChiP based power components enable customers to achieve costeffective power system solutions with previously unattainable system size, weight and efficiency attributes, quickly and predictably.